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MSM9836-xxx

¡ Semiconductor

GENERAL DESCRIPTION

The MSM9836 is a PCM voice synthesis IC with built-in 3-Mbit mask ROM, D/A converter, and
low-pass filter (LPF).
The MSM9836 is specifically designed for applications that use a microcontroller.
For this reason, functional support for standalone mode and RC oscillation has been omitted
from the MSM9805, and the ROM capacity and the number of phrases have been increased.
By using Oki's Sound Analysis and Editing Tool, ROM data such as Phrase Control Table can be
easily set, created, edited, and evaluated.
The following table lists the functional differences between the MSM9836 and the MSM9805.

¡ Semiconductor

MSM9836-xxx

Voice Synthesis IC with Built-in Mask ROM

FEATURES

· 8-bit OKI nonlinear PCM method/8-bit Straight PCM method
· Sampling frequency

: 4.0 kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/

(Can be set for each phrase)

16.0 kHz

· ROM capacity

: 3 Mbits

· Maximum playback time

: 97.7 sec (f

SAM

= 4.0 kHz)

73.7 sec (f

SAM

= 5.3 kHz)

61.0 sec (f

SAM

= 6.4 kHz)

48.8 sec (f

SAM

= 8.0 kHz)

· Master clock frequency

: 4.096 MHz

(Ceramic oscillation/external
clock input)

· Edit ROM function
· Maximum number of phrases

: 127

· Built-in current mode 10-bit D/A converter
· Built-in low-pass filter
· Power supply voltage

: +2.0 to +5.5 V

· Package :

24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM9836-xxxGS-K)

xxx indicates code number.

Chip

E2D0082-29-93

MSM9836

3 Mbits

Microcontroller

Ceramic

NAR/BUSY simultaneous output

127

MSM9805

2 Mbits

Microcontroller/Standalone

Ceramic/RC

Only NAR output when operating

in microcontroller interface mode

ROM Capacity

Interface

Oscillation

Status Signal

Maximum Number of

Phrases

This version: Sep. 1999

Previous version: May. 1997

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MSM9836-xxx

¡ Semiconductor

PIN DESCRIPTIONS

Symbol

Type

Description

The IC enters the standby state if this pin is set to "L" level. At this time, oscillation

stops and AOUT output becomes GND level, then the IC returns to the initial state.

Apply a "L" pulse upon power-on.

This pin has an internal pull-up resistor.

RESET

Signal output pin that indicates whether the 7-bit LATCH (see Block Diagram) is idle.

NAR at "H" level indicates that the LATCH is empty and ST input is enabled.

NAR

Ceramic oscillator input/external clock input switching pin. Set to "H" level if ceramic

oscillation is used. Set to "L" level if external clock is used.

EXTCK

Volume setting pin. If this pin is set to GND level, the maximum current is forced in,

and if set to V

level, the minimum current is forced in.

An approx. 10 kW pull-down resistor is internally connected to this pin during operation.

REF

Voice output pin.

The voice signals are output as current changes. A "L" level signal is output through

this pin in standby state.

AOUT

Ground pin.

GND

Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and

the GND pin.

Ceramic oscillator connection pin when ceramic oscillation is selected.

Input from this pin if external clock is used.

Ceramic oscillator connection pin when ceramic oscillation is selected.

Leave this pin open if external clock is used.

A "L" level signal is output through this pin in standby state.

Normally leave this pin open. This pin is used only for testing the internal circuit.

TEST

Voice synthesis starts at fall of ST, and addresses I0 to I6 are fetched at rise of ST.

Input ST when NAR, the status signal, is at "H" level.

This pin has internal pull-up resistor.

Phrase input pins corresponding to playback sound.

I0 - I6

Pin

10-15, 18

This pin is at "H" level after reset is input. A "L" level signal is output through this pin

for the time during which voice is being played.

BUSY

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MSM9836-xxx

¡ Semiconductor

Parameter

Symbol

Condition

Unit

"H" Input Voltage

Typ.

=5.0 V, GND=0 V, Ta=40 to +85°C, unless otherwise specified)

"L" Input Voltage

Min.

Max.

0.4

"H" Input Current 1

IH1

µA

4.6

0.8

4.2

"H" Output Voltage

=1 mA

"L" Output Voltage

=2 mA

"L" Input Current 1

IL1

µA

=GND

200

"L" Input Current 2 (*1)

IL2

µA

Internal pull-up resistor

0.4

Dynamic Supply Current 1 (*2)

DD1

REF

, AOUT voltage=0V

Standby Current

µA

Ta=40 to +70°C

REF

Pin Pull-Down Resistance

VREF

µA

Ta=40 to +85°C

9.5

AOUT Output Current

AOUT

At maximum output current

REF

, AOUT voltage=0V

"H" Input Current 2

IH2

µA

Applies to XT pin only.

Dynamic Supply Current 2 (*3)

DD2

At maximum output current

REF

=GND, AOUT voltage=0V

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

ELECTRICAL CHARACTERISTICS

DC Characteristics (1)

Parameter

Symbol

Condition

Rating

Unit

Power Supply Voltage

Input Voltage

Ta=25°C

0.3 to +7.0

Storage Temperature

0.3 to V

+ 0.3

STG

55 to +150

°C

(GND=0V)

Parameter

Symbol

Condition

Range

Unit

Power Supply Voltage

2.0 to 5.5

Original Oscillation Frequency

40 to +85

°C

OSC

Typ.

MHz

When crystal is selected

(GND=0 V)

Operating Temperature

Min.

Max.

4.096

3.5

4.5

*1 Applicable to RESET, ST
*2 Dynamic supply current excluding DAC output current
*3 Dynamic supply current at maximum output current

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MSM9836-xxx

¡ Semiconductor

DC Characteristics (2)

*1 Applicable to RESET, ST
*2 Dynamic supply current excluding DAC output current
*3 Dynamic supply current at maximum output current

Parameter

Symbol

Condition

Unit

"H" Input Voltage

Typ.

=3.1 V, GND=0 V, Ta=40 to +85°C, unless otherwise specified)

"L" Input Voltage

Min.

Max.

0.4

"H" Input Current 1

IH1

µA

2.6

0.5

2.7

"H" Output Voltage

=1 mA

"L" Output Voltage

=2 mA

"L" Input Current 1

IL1

µA

=GND

100

"L" Input Current 2 (*1)

IL2

µA

Internal pull-up resistor

0.15

0.5

Dynamic Supply Current 1 (*2)

DD1

REF

, AOUT voltage=0V

Standby Current

µA

Ta=40 to +70°C

REF

Pin Pull-Down Resistance

VREF

µA

Ta=40 to +85°C

3.2

1.4

AOUT Output Current

AOUT

At maximum output current

REF

, AOUT voltage=0V

"H" Input Current 2

IH2

µA

Applies to XT pin only.

5.5

Dynamic Supply Current 2 (*3)

DD2

At maximum output current

REF

=GND, AOUT voltage=0V

7/23

MSM9836-xxx

¡ Semiconductor

AC Characteristics

Parameter

Symbol

Condition

Unit

Master Clock Duty Cycle

duty

w(RST)

µs

Typ.

=5.0 V, GND=0 V, f

OSC

=4.096 MHz, Ta=40 to +85°C)

RESET Input Pulse Width

Min.

Max.

0.35

2000

Data Setup Time

µs

D(RST)

µs

RESET Input Time After Power-on

(ST)

µs

ST Input Pulse Width

NAR Output Time 1

SNS

µs

SAM

=8 kHz

375

350

400

NAR Output Time 2

NAA

µs

SAM

=8 kHz

440

315

500

NAR Output Time 3

NAB

µs

SAM

=8 kHz

375

350

500

NAR Output Time 4

NAC

µs

SAM

=8 kHz

D/A Converter Change Time

DAR

, t

DAF

250

200

300

Standby Transition Time

(at end of voice output)

STB

Data Hold Time

µs

The ST-ST Pulse Interval

Upon entering the stop code (*4)

STP

µs

ST Signal Setup Time

At power-on

375

350

500

Silence Time Between Phrases

BLN

µs

SAM

=8 kHz

BUSY Output Time 1

SBS

µs

SAM

=8 kHz

375

350

400

BUSY Output Time 2

BSYA

µs

SAM

=8 kHz

(*4)

*4 Proportional to master the periods of oscillation frequency f

OSC1

and f

OSC2

The rated values show values when the standard master oscillation frequency is used.

10/23

MSM9836-xxx

¡ Semiconductor

4. Stop Code Input Timing

I6 to I0 (I)

ST ( I )

NAR (O)

AOUT (O)

User phrase

"0000000"

Voice stop

BUSY (O)

When I6-I0 are set to "0000000" during voice playback (during the output of "L" level at the BUSY
pin), and a ST signal is input, playback stops regardless of whether NAR is at "H" or "L" level and
AOUT becomes 1/2 I

AOUT

. Stop code becomes valid at the falling edge of ST.

The stop code does not initialize internal units but only stops playback. To initialize an internal
register, use the RESET pin.

11/23

MSM9836-xxx

¡ Semiconductor

1. Sampling Frequency

As shown in Table 1.1, 7 sampling frequencies are available.
A sampling frequency can be selected and assigned to each phrase in ROM data.

Table 1.1 Sampling Frequency

2. Recording/Playback Time

Figure 2.1 below shows memory allocation of the on-chip Mask ROM. About 17 Kbits of data area
is allocated for the Phrase Control Table, Phrase Data Control and Test Data.
Therefore, actual data area for storing sound data equals the total Mask ROM capacity minus 17
Kbits.

16.0 kHz

OSC1

/256

12.8 kHz

OSC1

/320

10.6 kHz

OSC1

/384

8.0 kHz

OSC1

/512

6.4 kHz

OSC1

/640

5.3 kHz

OSC1

/768

4.0 kHz

OSC1

/1024

Sampling Frequency

At standard

oscillation frequency

Frequency diving ratio

Figure 2.1 Memory Allocation of On-chip Mask ROM

Phrase Control Table Area

Pharase Data Control Area

Test Data Area

User's Area

8K bit

1K bit

3055K bit

On-chip Mask ROM Capacity
3072K bit

12/23

MSM9836-xxx

¡ Semiconductor

3. Playback Method

This IC provides two kinds of playback methods, non-linear PCM algorithm and straight PCM
algorithm. When the 8-bit non-linear PCM algorithm is selected, sound quality can be improved
because a resolution equivalent to 10-bit straight PCM is available around the waveform center.
You can select either non-linear PCM algorithm or straight PCM algorithm for each phrase. Table
3.1 shows the relationship between playback methods and applicable sounds. It is recom-
mended to evaluate the sound quality before actual use.

Table 3.1 Relationship between playback methods and applicable sounds

The playback time is obtained by dividing the memory capacity by the bit rate.
The playback time for 8-bit PCM algorithm is obrained by using the following equation.

Memory capacity [bit]

Bit rate [bps]

Memory capacity [bit]

Sampling frequency [Hz] ¥ 8 [bit]

Playback time [sec] =

(307217) ¥ 1024 [bit]

8000 [Hz] ¥ 8 [bit]

Playback time =

= 48.8 [sec]

For example, if all phrases are stored in the MSM9836 at 8 kHz sampling frequency, the
maximum playback time is as follows.

Table 2.1 Maximum playback time

Playback method

Applicable sound

8-bit non-linear PCM algorithm Human voice

8-bit straight PCM algorithm

BEEP tone, sound effects

SAM

=16.0kHz

24.4

SAM

=8.0kHz

48.8

SAM

=6.4kHz

61.0

SAM

=4.0kHz

97.7

User's area

3055K bit

ROM capacity

3M bit

Maximum playback time (sec)

Model

MSM9836

13/23

MSM9836-xxx

¡ Semiconductor

4. Phrase Control Table

Because the LSI contains the Phrase Control Table, it is possible to play back multiple phrases in
succession by a single easy control operation like controlling a single regular phrase playback.
Up to 8 combined phrases including a silence can be registered in a single address in the Phrase
Control Table.
Further, you can use the maximum memory space for data storage because it is not required to
have the same phrase data.
To show an example, let's assume that your application needs to speak two similar sentences, "It
is fine today" and "It is rainy today." The two sentences have the common words "it", "is" and
"today". What you have to do is to prepare these common sound data, not in sentences but in
words, and to store each combined phrase data in Phrase Control Table as shown in Table 4.1 and
Figure 4.1
Multiple phrases can be played continuously merely by specifying a desired phrase using an X
address. For an example from Table 4.1, when address "01" is specified, "It is fine today" is played,
and when address"02" is specified, "It is rainy" is played.
Phrase Control Table, a silence can be inserted without using the User's Area.

Minimum time for silence

32 ms

Maximum time for silence

4064 ms

Time unit for setting up silence

32 ms

Table 4.1 Matrix of the Phrase Control Table

No.

X-Address

(HEX)

Y-Address

(Up to 8 phrases)

Sound Data

126

127

· · ·

[10]

Silence

[02]

[01]

[03]

[12]

Silence

[02]

[01]

[03]

[21]

[10]

[02]

[01]

[11] [12] [22] [03]

· · ·

It is (silence) fine today.

It is (silence) rainy today.

It is fine becoming cloudy, rainy in some areas today.

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MSM9836-xxx

¡ Semiconductor

Figure 4.1 Phrase Combination Matrix for Phrase Control Table

No. Y-Address

Phrase

127

Phrase Data Registration Area

[01]

[02]

Silence (64ms)

[12]

[03]

Phrase Control Table Area

Phrase Addigned

Silence time

32 ms

64 ms

127

4064 ms

Silence time setting

(32ms

¥ n)

No. X-Address

127

today

fine

cloudy

rainy

snowy

occasionally

becoming

in some areas

rainy

today

15/23

MSM9836-xxx

¡ Semiconductor

5. Oscillation and Clock Input

5. 1 Ceramic oscillation

Figure 2 shows an external circuit using a ceramic oscillator.

Figure 2 External Circuit Using a Ceramic Oscillator

EXTCK

Pull this pin to "H" level

For example, the following table shows the optimum load capacitances, power supply voltage
ranges, and operating temperature ranges when ceramic oscillators made by Murata MFG Co.,
Ltd., and TDK Co., Ltd. are used.

(Note)

When a 4 MHz ceramic oscillator is used, the playback speed of MSM9802/03/05 is
slower by 2 percent than that of an analysis tool or a demonstration board.

Maker

Frequency

(MHz)

CSA4.09MGU

Type

Operating

temperature range

(°C)

supply voltage range

(V)

C1 (pF)

C2 (pF)

Optimal load capacity

Ceramic oscillator

4.09

40 to +85

2.0 to 5.5

CST4.09MGWU

4.09

2.0 to 5.5

CCR4.00MC3

4.0

40 to +85

2.4 to 5.5

Built in

Murata MFG.

TDK

17/23

MSM9836-xxx

¡ Semiconductor

6. Low-Pass Filter

In this IC, all voice outputs are through the built-in low-pass filter (LPF). Figure 4 and Table 4
show the LPF frequency characteristics and LPF cutoff frequency respectively.
Only the voice output through LPF is enabled in this IC.

Figure 4 LPF Frequency Characteristics (f

SAM

=8 kHz)

Table 4 LPF Cutoff Frequency

[dB]

100

10k

[Hz]

Sampling Frequency (kHz)

Cutoff Frequency (kHz)

SAM

)

CUT

)

1.2

1.6

4.0

5.3

2.0

6.4

2.5

8.0

3.2

10.6

4.0

12.8

5.0

16.0

18/23

MSM9836-xxx

¡ Semiconductor

7. Standby Transition

When playback of a phrase is finished, if playback of the next phrase does not start up within
t

STB

(0.25 sec. typ.), the IC enters standby status and the entire operation stops.

I5-I0

NAR

AOUT

BUSY

Figure 5 Voice Playback Timing during D/A Converter Change Time

If playback is attempted during D/A converter change time as shown in Figure 5, the IC exits
from standby status and the output from the D/A converter begins going to the 1/2 I

AOUT

level.

When the output reaches 1/2 I

AOUT

, voice playback starts.

20/23

MSM9836-xxx

¡ Semiconductor

D/A CONVERTER OUTPUT CURRENT CHARACTERISTICS

Power Supply Voltage vs. Output Current Characteristics (Ta=25

C, V

AOUT

=0V)

AOUT Output Current [mA]

Power Supply Voltage [V]

Temperature vs. Output Current Characteristics (V

=5V, V

AOUT

=0V)

100

AOUT Output Current [mA]

Ambient Temperature Ta [°C]

REF

Voltage vs. Output Current Characteristics (Ta=25

C, V

=5V, V

AOUT

=0V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

REF

[V]

AOUT Output Current [mA]

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MSM9836-xxx

¡ Semiconductor

PAD CONFIGURATION

Pad Layout

Chip size

X=7.65mm Y=3.32mm

Chip thickness

350mm

30mm

Pad size

110mm¥110mm

Substrate potential

GND

Chip and pad number

Y-axis

X-axis

MSM9836

(NC)

Pad coordinates (Chip center is located at X=0 and Y=0)

PAD No.

PAD Name

X-axis

Y-axis

PAD No.

PAD Name

X-axis

Y-axis

3620

452

3673

415

3623

742

3673

816

3623

1349

3673

1460

TEST

1932

1460

RESET

1778

1460

BUSY

1044

1455

1260

1458

EXTCK

1163

1453

NAR

2443

1460

2234

1455

GND

3665

1460

3673

1432

REF

3623

1136

3673

754

AOUT

3623

585

(Unit: mm)

3673

312

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MSM9836-xxx

¡ Semiconductor

(Unit : mm)

PACKAGE DIMENSIONS

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

SOP24-P-430-1.27-K

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.

Mirror finish

NOTICE

The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.

The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.

When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.

Oki assumes no responsibility or liability whatsoever for any failure or unusual or
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.

Neither indemnity against nor license of a third party's industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party's right which may result from the use thereof.

The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.

Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.

No part of the contents contained herein may be reprinted or reproduced without our prior
permission.

MS-DOS is a registered trademark of Microsoft Corporation.

Printed in Japan

E2Y0002-29-62

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